As a demonstrator, a cooling device for power electronics is chosen because it combines typical challenges in a prototypical way: complex metal geometries made of challenging materials such as copper are built on a ceramic-based substrate with the required precision in the low micrometre range. Today, heat sinks with limited complexity are soldered onto the substrate to be cooled. This adds layers, lengthens the cooling path and reduces thermal efficiency. As a result, the dimensions of the cooler must be increased. Printing heat sinks directly onto the substrate eliminates the need for additional layers and significantly reduces thermal resistance. This allows for a smaller package volume/smaller semiconductor chips and therefore reduced costs. In addition, the design freedom offered by additive manufacturing allows cooling devices to be further improved in terms of cooling performance, helping to reduce package volume even further. Furthermore, in conventional manufacturing, tooling for complex cooling structure geometries is costly and time-consuming. In contrast, laser powder bed fusion is a fully digital, flexible process. With an expected market size of several million pcs/year inverters or more general power electronics is a true mass application of metal laser powder bed fusion addressing key industries such as automotive electronics and supporting electrified mobility and global sustainability.